Product

Introduce Our Product

UDNANO

Nano Materials

Hybrid graphene manufactured in a hybrid method

Hi-puri: 99at%≥C (O≤0.95at%, S≤0.05at%) High purity, Particle-size: 5㎛, Thickness: <5nm, high-performing graphene, dispersion, conductivity and thermal conductivity.
Hydra: Hydrogen content: 3at%, Particle-size: 5㎛, Thickness: <5㎚, graphene designed to induce changes in the physical properties of the base.


Composite

Meet graphene with infinite possibilities

Hi-puri Coated Al: Used as a material to suppress the separation between graphene - metal. Particle-size: 21㎛, made from Hi-puri coated in aluminum.
Hydra Coated Al: Used as a material to suppress the separation between graphene - metal. Particle-size: 21㎛, made from Hydra is coated in aluminum.
Hi-puri Functionalized SnO2: Applied as a material for NO2 gas measurement at room temperature. Particle-size: 1.8㎛, made from the functionalized SnO2. by 3wt% of graphene.
Hi-puri Functionalized Ag: Available for contact materials and semiconductor devices. Particle-size: 10㎛ powder made from the functionalized Ag by 3wt% of graphene.
Hi-puri Riched SnO2: Particle-size: 11.8㎛, 30wt% of SnO2 nanoparticles are functionalized on graphene.
Hi-puri Riched ZnO: Particle-size: 11㎛, 30wt% of ZnO nanoparticles are functionalized on graphene.
Hi-puri Riched Ag: Particle-size: 11㎛, 30wt% of Ag nanoparticles are functionalized on graphene.


Paste / Ink

Conductive Paste/Ink

HICON-T: Max 900°C (available), 10Ω/sq, Gel type, High conductivity, High temperature adhesion, Hardness: 3H, Non-volatile, Life waterproofing product. (Silkscreen available)
HICON-N: Enough applying time & workability - when silkscreening, Mid-viscosity, Max 350°C (available), 29.6Ω/sq.
HICON-V: Flexibility, Strong waterproofing, Good diffusion, Curing conditions: (Surface) 5 secs at 25°C, Maximum available temperature: 200°C, 99.6 Ω/sq.
HICON-I: Ink form, Flexibility, Strong waterproofing, Good diffusion, Curing conditions: (Surface) 20 secs at 25°C, Maximum available temperature: 200°C, 99.6 Ω/sq.
HICON-S: For Spray, Flexibility, Strong in water condition, Good diffusion, Curing conditions: (Surface) 50 secs at 25°C, Maximum available temperature: 200°C, 99.6 Ω/sq.


Paint

Heat-resistant paint

HIST-C: By applied thickness, controlling the heat emission/radiation, Protected from heat. Hardness: more than 6H, Insulated, Excellent adhesion and life waterproofing product.
HIST-CS: For spraying. Same as HIST-C.
HIST-P: Possible to apply thinly spraying, Strong flame retardant. Hardness: more than 6H. Insulation, Excellent adhesion and life waterproof product.
HIST-PS: For spraying. Same as HIST-P.

UDCORE

Unit

Heater parts, 300% efficiency, 1/3 of power consumption (compared to ceramic heaters)

Hience-F: 0.2㎜ of thickness, Flexible film heater, Appearance material: Polyimide Maximum available temperature: 200℃.
Hience-U: 400°C(Stable use), 1.5㎜ of thickness, Plate heaters, Heating the 500㎜x120㎜ area by 220V/800W/400°C.
Hience-SU: 600°C(Stable use), Thickness: 1.5㎜, Plate heaters, Heating the 50㎜x50㎜ area by 28V/87W/600°C.


Module

Block heater module, 300% efficiency, 1/3 power consumption (compared to PTC heaters)

Hience-M: Modules that easy expansion of three-axis between parts. By 220V/400W, Heating the air in 130°C with 2m/s wind speed. By 28V/87W, Heating the air in 80°C with 3.5m/s wind speed.


Material for Electric

SnO2 for Gas sensing

SnO2 for Gas sensing: 25°C, Room temperature detecting the NO2 gas.


Metal Casting Materials

Castings materials capable of mass-producing graphene metal alloys
When using ours as an additives or main materials for casting alloys, can improve and control elasticity, yield, tensile strength and elongation.

Hi-puri Al mixture: Particle-size: 21㎛, Hi-puri and aluminum mixture/composite.
Hi-puri Al composite: Particle-size: 21㎛, Hi-puri and aluminum mixture/composite.
Hydra Al mixture: Particle-size: 21㎛, Controlling characteristics by regulating hydrogen content in Hi-puri and aluminum mixture/composite.
Hydra Al composite: Particle-size: 21㎛, Controlling characteristics by regulating hydrogen content in Hi-puri and aluminum mixture/composite.

UDPIS & UDMRP

Smart industrial system developement

Program for the spread of smart industrial systems.
It is a business group that is expected with the complete landing of 5G with technologies that will help small and medium-sized enterprises manage logistics and establish automatic reporting systems, manage production facilities, predict production cycles and efficiency.

UDPIS: Inventory logistics management, web browser based, mobile use available, automatic reporting program (medicine serial number management).
UDMRP: Managing Software site - Manufacturing Equipment.